Monitor Structures and Methods of Formation Thereof

ABSTRACT

A method of forming an electronic device includes forming a first opening and a second opening in a workpiece. The first opening is deeper than the second opening. The method further includes forming a fill material within the first opening to form part of a through via and forming the fill material within the second opening.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present invention is a divisional of U.S. application Ser. No.14/834,846 filed on Aug. 25, 2015, which is a divisional of U.S.application Ser. No. 13/531,129 filed on Jun. 22, 2012, now issued asU.S. Pat. No. 9,147,610. All of the above applications are incorporatedherein by reference.

TECHNICAL FIELD

The present invention relates generally to electronic devices, and moreparticularly to monitor structures and methods of formation thereof.

BACKGROUND

Semiconductor devices are used in many electronic and otherapplications. Semiconductor devices may comprise integrated circuitsthat are formed on semiconductor wafers. Alternatively, semiconductordevices may be formed as monolithic devices, e.g., discrete devices.Semiconductor devices are formed on semiconductor wafers by depositingmany types of thin films of materials over the semiconductor wafers,patterning the thin films of material, doping selective regions of thesemiconductor wafers, and other processes.

In a conventional semiconductor fabrication process, a large number ofsemiconductor devices are fabricated within and/or over a single wafer.A semiconductor device may comprise one or more through silicon vias forinformation or power routing through a silicon chip and for connectingto the chip backside. In particular, silicon interposers havingfrontside and backside metallization layers exhibiting tailored throughcontacts fabricated by through silicon vias. Each of the semiconductordevices may comprise a plurality of through vias. Similarly,semiconductor packages comprising these semiconductor devices may alsoinclude a plurality of through vias.

However, forming through vias introduces various process complexities,which can result in significant yield loss.

SUMMARY

These and other problems are generally solved or circumvented, andtechnical advantages are generally achieved, by illustrative embodimentsof the present invention.

In accordance with an embodiment of the present invention, a method offorming an electronic device comprises forming a first opening and asecond opening in a workpiece. The first opening is deeper than thesecond opening. The method further comprises forming a fill materialwithin the first opening to form part of a through via and forming thefill material within the second opening.

In accordance with an embodiment of the present invention, a method offorming a semiconductor device comprises forming a first opening for athrough via in a first workpiece and a second opening for a monitorstructure. The first opening is deeper than the second opening. Themethod further comprises depositing a fill material within the secondopening up to a fill depth and using a measurement of the fill depthwithin the second opening, and depositing the fill material within thefirst opening.

In accordance with an embodiment of the present invention, an electronicdevice comprises a functional conductive structure disposed in a workpiece and a non-functional monitor structure disposed in the workpiece.The monitor structure is configured for use in monitoring thefabrication of the functional conductive structure.

In accordance with an embodiment of the present invention, a devicecomprises an electronic chip, an encapsulant proximate the electronicchip, and a conductive structure disposed in the encapsulant. Theconductive structure is not coupled to the electronic chip. Theencapsulant has about a same thickness as the electronic chip.

The foregoing has outlined rather broadly the features of an embodimentof the present invention in order that the detailed description of theinvention that follows may be better understood. Additional features andadvantages of embodiments of the invention will be describedhereinafter, which form the subject of the claims of the invention. Itshould be appreciated by those skilled in the art that the conceptionand specific embodiments disclosed may be readily utilized as a basisfor modifying or designing other structures or processes for carryingout the same purposes of the present invention. It should also berealized by those skilled in the art that such equivalent constructionsdo not depart from the spirit and scope of the invention as set forth inthe appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present invention, and theadvantages thereof, reference is now made to the following descriptionstaken in conjunction with the accompanying drawing, in which:

FIG. 1, which includes FIGS. 1A-1B, illustrates a semiconductor devicein accordance with an embodiment of the invention, wherein FIG. 1Aillustrates a top sectional view and wherein FIG. 1B illustrates across-sectional view;

FIG. 2, which includes FIGS. 2A-2C, illustrates an alternativesemiconductor device in accordance with an embodiment of the invention,wherein FIG. 2A illustrates a top sectional view and wherein FIGS. 2Band 2C illustrate a cross-sectional view;

FIG. 3, which includes FIGS. 3A-3C, illustrates an alternativesemiconductor device in accordance with an embodiment of the invention,wherein FIG. 3A illustrates a top sectional view and wherein FIG. 3B andFIG. 3C illustrate a cross-sectional view;

FIG. 4 illustrates a top cross-sectional view of a semiconductor deviceaccording to an embodiment of the invention;

FIG. 5, which includes FIGS. 5A and 5B, illustrates a semiconductorpackage in accordance with an embodiment of the invention, wherein FIG.5A illustrates a top sectional view and wherein FIG. 5B illustrates across-sectional view;

FIG. 6, which includes FIGS. 6A and 6B, illustrates a magnifiedcross-sectional of a through via and the monitor structure in accordancewith embodiments of the invention;

FIG. 7, which includes FIGS. 7A-7I, illustrates a semiconductor deviceduring various stages of fabrication in accordance with embodiments ofthe invention; and

FIG. 8 illustrates operations during part of the process flow inaccordance with embodiments of the invention.

Corresponding numerals and symbols in the different figures generallyrefer to corresponding parts unless otherwise indicated. The figures aredrawn to clearly illustrate the relevant aspects of the embodiments andare not necessarily drawn to scale.

DETAILED DESCRIPTION OF ILLUSTRATIVE EMBODIMENTS

The making and using of various embodiments are discussed in detailbelow. It should be appreciated, however, that the present inventionprovides many applicable inventive concepts that can be embodied in awide variety of specific contexts. The specific embodiments discussedare merely illustrative of specific ways to make and use the invention,and do not limit the scope of the invention.

A structural embodiment of a semiconductor device will be describedusing FIG. 1. Further structural embodiments of the semiconductor devicewill be described using FIGS. 2-6. Various methods of fabricating thesemiconductor device will be described using FIGS. 7 and 8.

FIG. 1, which includes FIGS. 1A-1B, illustrates a semiconductor devicein accordance with an embodiment of the invention, wherein FIG. 1Aillustrates a top sectional view and wherein FIG. 1B illustrates across-sectional view.

Referring to FIG. 1A, a semiconductor device comprises an electronicchip 10. In various embodiments, the electronic chip 10 may comprise anysuitable substrate material. In one or more embodiments, the electronicchip 10 may comprise a silicon substrate. In alternative embodiments,the electronic chip 10 may comprise a semiconductor on insulatorsubstrate. In a further alternative embodiment, the electronic chip 10may comprise other semiconductor substrates such as silicon carbon,silicon germanium, gallium nitride, InSb, InP, gallium arsenide, andothers.

In various embodiments, the electronic chip 10 may comprise asemiconductor chip. The electronic chip 10 may also comprise any othertype of chips, for example, plastic, organic devices, and others. Invarious embodiments, the electronic chip 10 may comprise functionalcircuitry and may comprise integrated circuits. The electronic chip 10may comprise a logic chip, a memory chip, an analog chip, a mixed signalchip, power devices, and other types of circuitry. In one or moreembodiments, the electronic chip 10 may comprise a plurality of devicessuch as a plurality of transistors including field effect transistors,bipolar transistors, IGBTs, JFETs, diodes, and others.

In various embodiments, the electronic chip 10 comprises a plurality ofthrough vias 20. As illustrated in FIG. 1B, the plurality of throughvias 20 extend through the electronic chip 10. The plurality of throughvias 20 may comprise a conductive material in various embodiments. Theplurality of through vias 20 may couple a back surface of the electronicchip 10 to a front surface of the electronic chip 10 in one or moreembodiments. Alternatively, in some embodiments, the plurality ofthrough vias 20 may be used to couple adjacent (stacked) semiconductordevices.

As further illustrated in FIG. 1A, the electronic chip 10 comprises amonitor structure 30. In various embodiments, the monitor structure 30may comprise a conductive material similar to the plurality of throughvias 20. In one or more embodiments, the monitor structure 30 comprisesa partial via which extends from one surface of the substrate butwithout extending to the other surface.

As illustrated in FIG. 1B, the monitor structure 30 has a depth lessthan the thickness of the electronic chip 10. In one or moreembodiments, the monitor structure 30 is used as a structure to monitorthe formation of the plurality of through vias 20 during fabrication. Aswill be described in further detail below, the monitor structure 30 isused to ensure that the fill height of the plurality of through vias 20matches the process parametrics.

In one or more embodiments, the number of monitor structure 30 relativeto the number of through vias 20 may be quite less. In one or moreembodiments, a single monitor structure 30 may be used to monitor atleast ten through vias 20. In a further embodiment, at least fiftythrough vias 20 may have a single monitor structure 30. In yet anotherembodiment, at least hundred through vias 20 may have a common monitorstructure 30.

As a further example, the electronic chip 10 may comprise about 1 toabout 100,000 through vias 20 and about 1 to about 5000 monitorstructures 30 in various embodiments. In various embodiments, the ratioof the number of monitor structures 30 to the number of through vias 20may vary from about 1:1 to about 1:100,000.

Thus, in various embodiments, the number of monitor structure 30 neededto monitor a large number of through vias 20 is quite minimal.Advantageously, the monitor structures 30 take up minimal area on thesemiconductor device.

In one or more embodiments, the monitor structure 30 may be coupled to aground potential node. In alternative embodiments, the monitor structure30 may not be coupled to the functional circuitry disposed in theelectronic chip 10. In some embodiments the monitor structure 30 may befloating.

FIG. 2, which includes FIGS. 2A-2C, illustrates an alternativesemiconductor device in accordance with an embodiment of the invention,wherein FIG. 2A illustrates a top sectional view and wherein FIGS. 2Band 2C illustrate a cross-sectional view.

In various embodiments, the monitor structure may have different shapesand sizes. In one or more embodiments, the shape and size of the monitorstructure may depend on the shape and size of the through substrate viabeing formed. As illustrated in FIG. 2A, in one embodiment, theelectronic chip 10 may comprise a plurality of through vias 20 and acorresponding monitor structure 30. Further, the electronic chip 10 maycomprise a second through substrate via 21 and a corresponding secondmonitor structure 31. The second monitor structure 31 may have adifferent height or different width (critical dimension) than themonitor structure 30. This is illustrated in FIGS. 2B and 2C. FIG. 2Billustrates the monitor structure 30 having a first height H1 while FIG.2C illustrates the second monitor structure 31 having a second heightH2.

FIG. 3, which includes FIGS. 3A-3C, illustrates an alternativesemiconductor device in accordance with an embodiment of the invention,wherein FIG. 3A illustrates a top sectional view and wherein FIG. 3B andFIG. 3C illustrate a cross-sectional view.

FIG. 3 illustrates an alternative embodiment in which the shape and sizeof the monitor structure depends on the density of the through substratevias. Referring to FIG. 3A, the electronic chip 10 may comprise a firstregion 1 and a second region 2. However, the density of the through viasin the first region 1 is different from the density of the through viasin the second region 2. For example, the first region 1 may comprise afirst set of through vias 20 having a first pitch W1 while the secondregion 2 may comprise a second set of through substrate vias 21 having asecond pitch W2. As illustrated, the first pitch W1 is different fromthe second pitch W2. In one case, the second pitch W2 is smaller thanthe first pitch W1.

The monitor structures in the first region 1 may be different from themonitor structures in the second region 2. As illustrated in FIG. 3B,the monitor structure 30 may have a first critical dimension CD1 whilethe second monitor structure 31 may have a second critical dimensionCD2. In various embodiments, the first critical dimension CD1 may bedifferent than the second critical dimension CD2. In one embodiment, thesecond critical dimension CD2 is smaller than the first criticaldimension CD1 due to the higher density of through substrate vias in thesecond region 2.

Similarly, the monitor structure 30 may have a first height H1 that isdifferent from the second height H2 of the second monitor structure 31.In one embodiment, the second height H2 is less than the first height H1due to the higher density of through substrate vias in the second region2.

Accordingly, in various embodiments, the shape and size of the monitorstructures may be varied depending on the shape, size, and density ofthe through substrate vias that are being monitored during fabrication.

FIG. 4 illustrates a top cross-sectional view of a semiconductor deviceaccording to an embodiment of the invention.

In various embodiments, the shape of the monitor structures may bedifferent from the shape of the through vias 20. Referring to FIG. 4,the monitor structure 30 may be formed as a trench in one or moreembodiments even though the through substrate vias 20 comprise a certaincircular or elliptical shape. In other alternate embodiments, themonitor structure 30 may have other shapes such as trapezoidal,hexagonal, octagonal, T-shape, H-shape, and others.

FIG. 5, which includes FIGS. 5A and 5B, illustrates a semiconductorpackage in accordance with an embodiment of the invention, wherein FIG.5A illustrates a top sectional view and wherein FIG. 5B illustrates across-sectional view.

Embodiments of the invention also include through vias formed insemiconductor packages, for example, in an embedded wafer level process.Referring to FIG. 5A, the semiconductor package includes the electronicchip 10 disposed within. The electronic chip 10 may be any type ofsemiconductor component in various embodiments. In one or moreembodiments, the electronic chip 10 may be a logic chip, an analog chip,a mixed signal chip, a memory chip, and/or a discrete component.

In various embodiments, the electronic chip 10 may be packaged using anytype of packaging technology. A plurality of through vias 20 aredisposed adjacent the electronic chip 10 within an encapsulant 15. Theencapsulant 15 provides mechanical support and hermetic sealing to theelectronic chip 10. In various embodiments, the encapsulant 15 may haveabout the same thickness as the electronic chip 10. For example, adielectric layer may be disposed above the encapsulant 15 and theelectronic chip 10 and may comprise redistribution lines and may be usedto couple to contacts.

As illustrated in FIG. 5A, a monitor structure 30 is disposed within theencapsulant 15. As further illustrated in FIG. 5B, the monitor structure30 does not extend completely through the encapsulant 15 and istherefore not a functional through package via. The monitor structure 30may be designed similar to the monitor structures as described in priorembodiments. In various embodiments, the monitor structure 30 may not beconnected to any other component. In other words the monitor structure30 may not be coupled to the electronic chip 10 and may serve no otherpurpose besides being used as a monitor during the fabrication of thethrough vias 20.

In one or more embodiments, the number of monitor structure 30 to thenumber of through vias 20 may be quite less. In one or more embodiments,at least ten through vias 20 may use a single monitor structure 30. In afurther embodiment, at least fifty through vias 20 may have a singlemonitor structure 30. In yet another embodiment, at least hundredthrough vias 20 may have a common monitor structure 30. Thus, in variousembodiments, the number of monitor structure 30 needed to monitor alarge number of through vias 20 is quite minimal. Advantageously, themonitor structures 30 require minimal area on the semiconductor package.

In one or more embodiments, the monitor structure 30 may not be coupledto any functional circuitry on the electronic chip 10. In someembodiments, the monitor structure 30 may be coupled to a groundpotential node. In further embodiments, the monitor structure 30 may befloating.

FIG. 6, which includes FIGS. 6A and 6B, illustrates a magnifiedcross-sectional of a through via and the monitor structure in accordancewith embodiments of the invention.

Referring to FIG. 6A, a through via 20 is disposed within a electronicchip 10 (alternatively within an encapsulant in case of a semiconductorpackage). The through via 20 comprises a liner 25 and the fill material70 in various embodiments. The liner 25 may comprise a plurality oflayers in various embodiments. In one or more embodiments, the liner 25may comprise a dielectric liner 40, a metal liner 50, and the seed layer60.

As illustrated in FIG. 6A, the through vias 20 may be isolated from theelectronic chip 10 by a dielectric liner 40. The dielectric liner 40 isformed as a spacer on the sidewalls of the opening forming the throughvia 20. In various embodiments, the dielectric liner 40 may be an oxide,nitride, oxynitride, or a low-k dielectric material layer. In someembodiments, the dielectric liner 40 may comprise a high-k dielectricmaterial. The dielectric liner 40 is optional and may not be used insome embodiments.

A metal liner 50 is disposed over the dielectric liner 40 in variousembodiments. The metal liner 50 acts as a metal diffusion barrier insome embodiments. In one embodiment, the metal liner 50 comprises Ta,TaN, TiW, Ti, TiN, Ru, W, WN, WCN, or a combination thereof.

In various embodiments, the metal liner 50 may have a thickness of about20 nm to about 200 nm. In one or more embodiments, the metal liner 50may have a thickness of about 50 nm to about 150 nm. In one or moreembodiments, the metal liner 50 may have a thickness of about 100 nm toabout 200 nm. In one or more embodiments, the metal liner 50 may have athickness of about 100 nm.

An optional seed layer 60 is disposed over the metal liner 50. The seedlayer 60 may be used as a seed for the deposition of the subsequent fillmaterial. The seed layer 60 may comprise copper in one embodiment. Theseed layer 60 may have a thickness of about 30 nm to about 3000 nm invarious embodiments. The seed layer 60 may have a thickness of about 30nm to about 300 nm in or more embodiments. In one or more embodiments,the seed layer 60 may have a thickness of about 200 nm to about 400 nm.In one or more embodiments, the seed layer 60 may have a thickness ofabout 250 nm to about 350 nm. In one or more embodiments, the seed layer60 may have a thickness of about 300 nm.

A fill material 70 is disposed over the metal liner 50 in variousembodiments. In one or more embodiments, the fill material 70 isdisposed over the seed layer 60. In one or more embodiments, the fillmaterial 70 may comprise copper. In alternative embodiments the fillmaterial 70 may comprise aluminum, titanium, tantalum, silver, gold,nickel, palladium, zinc, cobalt, doped polysilicon, titanium nitride,tantalum nitride, tungsten nitride silicides, and others.

As illustrated in FIG. 6A, the fill material 70 may fill up to athickness of a first fill height FH1. A ratio of the first fill heightFH1 to the total thickness of the electronic chip 10 may be about 1:2 toabout 1:10 in various embodiments.

As further illustrated in FIG. 6A, in various embodiments, a void 80 maybe disposed within the through via 20. In one or more embodiments, thevoid 80 may be sealed by subsequent dielectric layers formed over thesubstrate of the electronic chip 10. Alternatively, in some embodiments,the void 80 may comprise dielectric materials deposited subsequently.

FIG. 6B illustrates a magnified cross-sectional view of the monitorstructure 30 in accordance with embodiments of the invention.

As illustrated in FIG. 6B, the monitor structure 30 may comprise a liner25 similar to the liner 25 of the through via 20 as described in FIG.6A. As described above, the liner 25 may comprise a dielectric liner 40,the metal liner 50, and a seed layer 60.

Unlike the through via 20 illustrated in FIG. 6A, the monitor structure30 extends partially into the substrate of the electronic chip 10.Further, the fill material 70 more or less fills the opening of themonitor structure 30. In one embodiment, a top surface of the fillmaterial 70 is coplanar with the top surface of the substrate of theelectronic chip 10. However, in alternative embodiments, the top surfaceof the fill material 70 may be above or below the top surface of thesubstrate of the electronic chip 10.

The second fill height FH2 of the fill material 70 in the monitorstructure 30 may be about the same as the first fill height FH1 of thefill material 70 in the through via 20 in one or more embodiments. Inalternative embodiments, the second fill height FH2 of the fill material70 in the monitor structure 30 may be different from the first fillheight FH1 of the fill material 70 in the through via 20.

In various embodiments, a ratio of the second fill height FH2 of thefill material 70 in the monitor structure 30 to the first fill heightFH1 of the fill material 70 in the through via 20 may be about 1:2 toabout 2:1. In various embodiments, a ratio of the second fill height FH2of the fill material 70 in the monitor structure 30 to the first fillheight FH1 of the fill material 70 in the through via 20 may be about1:1.5 to about 1.5:1. In various embodiments, a ratio of the second fillheight FH2 of the fill material 70 in the monitor structure 30 to thefirst fill height FH1 of the fill material 70 in through via 20 may beabout 1:1.2 to about 1.2:1.

Embodiments of the invention may be applied to any structure not just tothrough vias. For example, any structure with the high aspect ratio(e.g., greater than about 10:1) and which is partially filled maybenefit from the use of monitor structures described above using FIGS.1-6. In various embodiments, examples of such structures may includeburied bit lines, buried word line, trench capacitors, deep trenchstructures, and others.

FIG. 7, which includes FIGS. 7A-7I, illustrates a semiconductor deviceduring various stages of fabrication in accordance with embodiments ofthe invention. FIG. 8 illustrates operations during part of the processflow fabrication in accordance with embodiments of the invention.

FIG. 7A illustrates a substrate 100 having a plurality of dies after allfront end and back end processing. Front end processing refers to theformation of active device regions while back end processing refers tothe formation of metallization layers to interconnect the variousdevices of the integrated circuit. In other words, the substrate 100 maybe a processed wafer having a plurality of dies including metallizationformed therein. For example, in one or more embodiments, the substrate100 comprises a wafer having an array of dies on a front side.

In various embodiments, the substrate 100 may be silicon alloys andcompound semiconductors. The substrate 100 may be a wafer and mayinclude epitaxial layers in various embodiments. In one or moreembodiments, the substrate 100 may be a bulk silicon wafer or asilicon-on-insulator wafer. In some embodiments, the substrate 100 maybe an III-V substrate with elements from Group III and Group V, or thesubstrate 100 may be an II-VI substrate with elements from Group II andGroup VI. In one or more embodiments, the substrate 100 may be asilicon-on-sapphire (SOS) substrate. In one or more embodiments, thesubstrate 100 may be a germanium-on-insulator (GeOI) substrate. In oneor more embodiments, the substrate 100 may include one or moresemiconductor materials such as silicon, silicon germanium, siliconcarbon, germanium, gallium arsenide, indium arsenide, indium arsenide,gallium nitride, indium gallium arsenide, or indium antimonide.

The plurality of dies may comprise different type of dies includingintegrated circuits or discrete devices. In one or more embodiments, theplurality of dies in the substrate 100 may comprise logic chips, memorychips, analog chips, mixed signal chips, and combinations thereof suchas system on chip. The plurality of dies may comprise various types ofactive and passive devices such as diodes, transistors, thyristors,capacitors, inductors, resistors, optoelectronic devices, sensors,microelectromechanical systems, and others. In one alternativeembodiment, the substrate 100 comprises a plurality of dies, each diebeing a discrete device such as a single transistor. Examples ofdiscrete devices include power devices, vertical devices (currentflowing from top to bottom), and others.

In various embodiments, active regions on circuitry connecting theactive regions may be disposed proximate first side 111 or proximate asecond side 112.

In various embodiments, the substrate 100 may be a reconstituted wafer,for example, comprising a plurality of dies disposed in an encapsulant.Thus, the embodiments described with respect to FIG. 7 will be used toform the semiconductor devices/semiconductor packages illustrated inFIGS. 1-6.

A first dielectric layer 110 is disposed over the substrate 100. Invarious embodiments, the first dielectric layer 110 may comprise SiO₂,tetra ethyl oxysilane (TEOS), fluorinated TEOS (FTEOS), doped glass(borophosphosilicate glass (BPSG), phosphosilicate glass (PSG),borosilicate glass (BSG)), organo silicate glass (OSG), fluorinatedsilicate glass (FSG), spin-on glass (SOG), SiN, SiON, or low-kinsulating materials such as SiCOH.

The first insulating layer 110 may comprise a thickness of about 5000 nmor less in various embodiments. In one embodiment, the first insulatinglayer 110 comprises a thickness of about 50 nm to about 500 nm. Inanother embodiment, the first insulating layer 110 comprises a thicknessof about 100 nm to about 1000 nm. In another embodiment, the firstinsulating layer 110 comprises a thickness of about 500 nm to about 2000nm. In one embodiment, the first insulating layer 110 comprises athickness of about 1000 nm to about 3000 nm. In one embodiment, thefirst insulating layer 110 comprises a thickness of about 2000 nm.

Referring again to FIG. 7A, a first resist layer 120 is deposited andpatterned thereby forming a first opening 130. The pattern for the firstopening 130 comprises a wider section of the through substrate via thatis being formed.

In various embodiments, the first resist layer 120 may comprise a singleresist layer, or a multi-layer resist such as a bi-layer resist layer ora tri-layer resist. As an example, a tri-layer resist stack may comprisethree layers: a thick bottom resist layer over the first insulatinglayer 110, a middle resist layer over the bottom resist layer, and a topresist layer on top of the middle resist layer. For example, the topresist layer may be a patternable resist. The middle resist layer may,for example, be a material such as an anti-reflective coating (ARC) withhigh silicon content (Si BARC Si content >30 wt %). The Si BARC materialtypically comprises a SiO_(x)C_(y)(N_(y)) type compound, although othersuitable anti-reflective material may be used in case certain etchselectivity requirements are met. The ARC is used to block reflectedradiation from the underlying layers. The reflected radiation from theseunderlying layers may result in additional interference patterns andresult in line width variations in the top resist layer exposed toradiation. The bottom resist layer may be a hard baked organicdielectric layer (ODL). The top resist layer functions as mask foretching the middle resist layer which functions, besides its role asreflection suppressant, as the masking material for etching thecomparatively thicker bottom resist layer. A top ARC layer is formedover the top layer. The formation of the resist layer may include bakesor anneals after deposition of each layer.

As next illustrated in FIG. 7B, the first insulating layer 110 ispatterned using the first resist layer 120. After patterning the firstinsulating layer 110, any remaining first resist layer 120 may beremoved, for example, using an etching process. Thereby a second opening140 is formed in the first insulating layer 110. The second opening 140may have a first critical dimension W1 as illustrated in FIG. 7B. Invarious embodiments, the first critical dimension W1 may be about 10 μmto about 50 μm. In one or more embodiments, the first critical dimensionW1 may be about 10 μm to about 30 μm. In one embodiment, the firstcritical dimension W1 may be about 10 μm.

Referring to FIG. 7C, an etch stop layer 150 is deposited over the firstinsulating layer 110. In one or more embodiments, the first insulatinglayer 110 comprises a different material than the etch stop layer 150.In one or more embodiments, the etch stop layer 150 comprises a nitride,or silicon oxynitride. In alternative embodiments, the etch stop layer150 may comprise titanium nitride, tantalum nitride, and/or tungstennitride. The etch stop layer 150 may be deposited using a vapordeposition process such as chemical vapor deposition, plasma vapordeposition, as well as other types of deposition processes.

A hard mask layer 160 is deposited over the etch stop layer iso. Thehard mask layer 160 may have a thickness of about 1000 nm to about 5000nm in various embodiments. In one or more embodiments, the hard masklayer 160 may have a thickness of about 1000 nm to about 3000 nm. In oneor more embodiments, the hard mask layer 160 may have a thickness ofabout 1500 nm to about 2000 nm. The hard mask layer 160 may comprise aninorganic dielectric layer such as a silicon oxide layer in variousembodiments. In an alternative embodiment the hard mask layer 160 maycomprise an imide layer.

The hard mask layer 160 may be a single layer or comprise multiplelayers in various embodiments. The hard mask layer 160 protects thefirst insulating layer 110 during the subsequent through trench etchprocess. The material of the hard mask layer 160 may be selected basedon the selectivity to the etch chemistry of the through trench etchprocess. For example, in one embodiment, a high density plasma with afluorine chemistry may be subsequently used to etch the throughsubstrate opening, and the hard mask layer 160 comprises a SiO₂ hardmask.

Referring to FIG. 7D, a first hard mask opening 180 and the second hardmask opening 190 are formed. The second resist layer 170 is depositedand patterned using conventional lithography techniques. Using thepatterned second resist layer 170 as an etch mask, a first hard maskopening 180 and the second hard mask opening 190 are etched in the hardmask layer 160. The etching of the second hard mask opening 190 isstopped after reaching the etch stop layer 150, which is over thepatterned first insulating layer 110. In contrast, the etching of thefirst hard mask opening 180 may continue upto the etch stop layer 150,which is adjacent the surface of the substrate 100.

The exposed etch stop layer 150 is removed exposing the substrate 100 inthe first hard mask opening 180 and the first insulating layer 110 inthe second hard mask opening 190.

As next illustrated in FIG. 7E, using the first hard mask opening 180and the second hard mask opening 190, the substrate 100 is etched toform a first opening 210 for a through via and a second opening 220 forthe monitor structure.

The etching of the second opening 220 starts from the first insulatinglayer 110 while the etching of the first opening 210 starts from a topsurface of the substrate 100. In various embodiments, the material ofthe first insulating layer 110 is selected so as to etch slower than thesubstrate 100. In other words, for a given material of the firstinsulating layer 110 and the substrate 100, a etch process is selectedsuch that the etch rate of the first insulating layer 110 and thesubstrate 100 are different. Thus, the etching of the first insulatinglayer 110 is selected to be slower than the etching of the substrate100.

In one embodiment, the etch selectivity between the first insulatinglayer 110 and the substrate 100 may be about 1:20 so that for everymicron of first insulating layer 110 that is etched, at least 20 micronsof substrate 10 are etched. In one or more embodiments, the etchselectivity between the first insulating layer 110 and the substrate 100may be about 1:10 to about 1:30. In one or more embodiments, the etchselectivity between the first insulating layer 110 and the substrate 100may be about 1:5 to about 1:20.

In various embodiments, the depth of the first opening 210 may be about50 μm to about 100 μm. In one or more embodiments, the depth of thefirst opening 210 may be about 20 μm to about 200 μm. In one or moreembodiments, the depth of the first opening 210 may be about 20 μm toabout 80 μm. In various embodiments, the depth of the second opening 220may be about 10 μm to about 30 μm. In various embodiments, the depth ofthe second opening 220 may be about 5 μm to about 50 μm. In variousembodiments, the depth of the second opening 220 may be about 20 μm toabout 30 μm.

In various embodiments, a ratio of the depth of the first opening 210 tothe depth of the second opening 220 is about 3:1. In variousembodiments, a ratio of the depth of the first opening 210 to the depthof the second opening 220 is about 2:1 to about 4:1. In variousembodiments, a ratio of the depth of the first opening 210 to the depthof the second opening 220 is about 2:1 to about 10:1.

In various embodiments, the etching of the substrate 100 may beperformed using a Bosch Process or by using a vertical reactive ionetch. In the Bosch process, etching and deposition are alternativelyperformed and may be repeated many times. In a first step, a plasma etchis used to vertically etch an opening while in a second step apassivation layer is deposited so as to prevent widening of the openingin regions already etched. The plasma etch is configured to etchvertically, e.g., using sulfur hexafluoride [SF6] in the plasma. Thepassivation layer is deposited, for example, usingocta-fluoro-cyclobutane as a source gas. Each individual step may beturned on for a few seconds or less. The passivation layer protects thesubstrate 100 so as to prevent lateral etching. However, during theplasma etching phase, the directional ions that bombard the substrate100 remove the passivation layer at the bottom of the opening beingformed (but not along the sides) and etching continues. The Boschprocess may produce sidewalls that are scalloped.

Referring to FIG. 7F, the remaining hard mask layer 160 and the etchstop layer 150 are removed. In various embodiments, the hard mask layer160 and the etch stop layer 150 may be removed using an etching processsuch as wet etching.

Referring to FIG. 7G, a liner 25 is formed over the first opening 210and the second opening 220.

In various embodiments, the liner 25 is formed having a plurality oflayers. In one or more embodiments, the liner 25 may comprise adielectric layer, a barrier layer, and the seed layer. The barrier layermay be used to protect the underlying substrate 100 from the fillmaterial 70 to be deposited within the first and the second openings 210and 220. The dielectric layer and the seed layer are optional and maynot be used in some embodiments.

In various embodiments, the liner 25 comprises layers of tantalumnitride and tantalum. In some embodiments, the liner 25 comprisestungsten and outer liners of titanium and titanium nitride or othermetal liners or liner combinations. In one embodiment, the liner 25comprises a TiW/Cu layer stack or Ti/Cu/Ni layer stack. In variousembodiments, the liner 25 comprises Ti, TiN, Ta, TaN, Cu, Ni, Cr, Cr/Cu,Ni/V, Ti/Cu, TiW, Au, Ni/Au, Ni/Pd/Au, W, WN, WCN and combinationsthereof. In various embodiments, the liner 25 may be deposited usingsputter deposition, vapor deposition, printing, and other suitabletechniques.

Referring to FIG. 7G, a fill material 70 is formed into the firstopening 210 and the second opening 220.

In one or more embodiments, the fill material 70 comprises copper. In adifferent embodiment, the fill material 70 comprises tungsten. If thefill material 70 comprises tungsten, a bi-layer seed layer comprisingCVD titanium nitride and silicon doped tungsten may be used. Similarly,in some embodiments, doped poly-silicon, silver, gold and/or aluminummay be deposited inside the first opening 210 to form the throughsubstrate via 20.

The fill material 70 may be deposited using an electrochemicaldeposition process in one embodiment. In an alternate embodiment, thefill material 70 may be deposited using an electroless depositionprocess. In yet some embodiments, the fill material 70 may be depositedusing other deposition processes such as vapor deposition, sputtering,etc.

In various embodiments, the fill material 70 partially fills the firstopening 210. A partial fill is advantageous as it requires lessdeposition (electroplating) time and alleviates stress during subsequentprocessing.

However, the amount of fill, i.e., the first fill height FH1 of fillmaterial 70 in the first opening 210 is difficult to monitor. Incontrast, the second fill height FH2 of fill material 70 in the secondopening 220 is easier to monitor. Thus, monitoring the rate of fillingof the second opening 220 can help determine the rate of filling of thefirst opening 210. However, there may be some difference between therate of filling of the first opening 210 and the rate of filling thesecond opening 220. This difference, however, may be determinedperiodically, for example, using test runs and may be thereforecompensated.

In various embodiments, the second fill height FH2 of the fill material70 in the second opening 220 may be monitored using mechanical contactmeasurement sensors. As an example, a stylus-based surface profiler maybe used to measure step heights of the fill material 70 during thefilling process. The stylus may be placed in contact with the fillmaterial 70 and gently dragged along the surface of the fill material70. The vertical deflection of the stylus may be used to measure thechange in step height. In one embodiment, using such a tool, the stepheight Y2 of the top surface of the fill material 70 in the secondopening 220 may be measured. In various embodiments, the fill material70 in the second opening 220 may have a step height, i.e., may have atop surface that is not co-planar with a top surface of the substrate100. In various embodiments, other types of measurements tools may beused.

As illustrated in FIG. 7H, in one embodiment, the fill material 70 inthe second opening 220 may have a negative step height so that the topsurface of the fill material 70 in the second opening 220 is below thetop surface of the adjacent liner 25 and/or the first insulating layer110.

Next, in one embodiment, using another tool such as an ellipsometry, thedepth of the second opening 220 X2 may be measured. The ellipsometry maybe performed at an earlier process step in some embodiments. Thedifference between the depth of the second opening 220 X2 and the stepheight Y2 provides the second fill height H2.

In various embodiments, during the filling of the first opening 210 andthe second opening 220, the second fill height FH2 may be monitoredcontinuously (FIG. 8, boxes 310 and 320). If the second fill height FH2is satisfactory, i.e., within a target range, then the fill process iscompleted. On the other hand, if the second fill height FH2 is lowerthan a target fill height, the deposition of the fill material 70 may becontinued, e.g., for a longer time. In another case, if the second fillheight FH2 is height than a target fill height, the deposition of thefill material 70 is immediately stopped. Further, this information maybe fed into the process tool so that subsequent wafers in the lot may beprocessed by targeting a lower fill height, e.g., by reducing thedeposition time (FIG. 8, box 330).

Referring next to FIG. 7I, the fill material 70 is thus formed from thefirst opening 210 and the second opening 220 so as to form a through via20 and the monitor structure 30 respectively.

Thus, embodiments of the present invention enable in-line monitoring ofthe filling of the through vias 20. In various embodiments, subsequentprocessing may continue as in conventional semiconductor processing.

As described in various embodiments, a material that comprises a metalmay, for example, be a pure metal, a metal alloy, a metal compound, anintermetallic and others, i.e., any material that includes metal atoms.For example, copper may be a pure copper or any material includingcopper such as, but not limited to, a copper alloy, a copper compound, acopper intermetallic, an insulator comprising copper, and asemiconductor comprising copper.

While this invention has been described with reference to illustrativeembodiments, this description is not intended to be construed in alimiting sense. Various modifications and combinations of theillustrative embodiments, as well as other embodiments of the invention,will be apparent to persons skilled in the art upon reference to thedescription. As an illustration, the embodiments described in FIG. 7 maybe combined with the embodiments described in FIGS. 1-6. It is thereforeintended that the appended claims encompass any such modifications orembodiments.

Although the present invention and its advantages have been described indetail, it should be understood that various changes, substitutions andalterations can be made herein without departing from the spirit andscope of the invention as defined by the appended claims. For example,it will be readily understood by those skilled in the art that many ofthe features, functions, processes, and materials described herein maybe varied while remaining within the scope of the present invention.

Moreover, the scope of the present application is not intended to belimited to the particular embodiments of the process, machine,manufacture, composition of matter, means, methods and steps describedin the specification. As one of ordinary skill in the art will readilyappreciate from the disclosure of the present invention, processes,machines, manufacture, compositions of matter, means, methods, or steps,presently existing or later to be developed, that perform substantiallythe same function or achieve substantially the same result as thecorresponding embodiments described herein may be utilized according tothe present invention. Accordingly, the appended claims are intended toinclude within their scope such processes, machines, manufacture,compositions of matter, means, methods, or steps.

What is claimed is:
 1. A method of forming an electronic device, themethod comprising: forming a first opening and a second opening in aworkpiece, the first opening being deeper than the second opening; andforming a fill material within the first opening to form part of athrough via and forming the fill material within the second opening. 2.The method of claim 1, wherein the second opening is disposed in asemiconductor region of the workpiece.
 3. The method of claim 1, whereinthe workpiece comprises a semiconductor wafer.
 4. The method of claim 1,wherein the workpiece comprises a reconstituted wafer comprising aplurality of dies in an encapsulant, and wherein forming a first openingcomprises forming the first opening in the encapsulant.
 5. The method ofclaim 1, wherein the second opening comprising the fill material is usedfor monitoring forming of the through via.
 6. The method of claim 1,wherein the fill material is formed in the first opening and the secondopening using a common process.
 7. The method of claim 1, wherein thefill material is formed in the first opening and the second openingsimultaneously.
 8. The method of claim 1, further comprising measuring afill height of the fill material in the second opening.
 9. The method ofclaim 8, further comprising changing a time for the forming of the fillmaterial in the first opening based on the measurement.
 10. The methodof claim 8, further comprising: providing a second workpiece; andforming a fill material within an opening in the second workpiece basedon the measurement.
 11. The method of claim 1, further comprisingthinning the workpiece.
 12. A method of forming an electronic device,the method comprising: providing an electronic chip; forming anencapsulant proximate the electronic chip; forming a functionalconductive structure in the encapsulant; and forming a non-functionalmonitor structure in the encapsulant, wherein the non-functional monitorstructure has a same lateral dimension as the functional conductivestructure, wherein the non-functional monitor structure is deeper thanthe functional conductive structure, and wherein the non-functionalmonitor structure is configured for use in monitoring the fabrication ofthe functional conductive structure.
 13. The method of claim 12, whereinthe non-functional monitor structure is disposed in a semiconductorregion of a workpiece.
 14. The method of claim 13, wherein the workpiececomprises a reconstituted wafer.
 15. The method of claim 12, whereinforming the functional conductive structure comprises forming a firstopening in the encapsulant, and wherein forming the non-functionalmonitor structure comprises forming a second opening in the encapsulant.16. The method of claim 15, wherein a fill material is formed in thefirst opening and the second opening using a common process.
 17. Themethod of claim 15, wherein a fill material is formed in the firstopening and the second opening simultaneously.
 18. The method of claim15, further comprising measuring a fill height of a fill material in thesecond opening.
 19. The method of claim 18, further comprising changinga time for the forming of the fill material in the first opening basedon the measurement.
 20. The method of claim 15, further comprising:providing a second workpiece; and forming a fill material within anopening in the second workpiece based on the measurement.